Die- & Wire bonding (Chip on board)
If an application needs to be very small, flat or specific, Chip On Board can be a solution for you. Think of applications such as high-frequency, sensors, probes and chip-cards. Elect has the facilities and know-how for the placement and wire bonding of bare chips on different substrates such as ceramics, aluminum or PCB (FR4). Please inquire about our possibilities.
Capabilities:
- Aluminum: 17.5μm – 60μm (0.7mil – 2.4mil)
- Gold: 15.0μm – 75μm (0.5mil – 2.9mil)
- Fine pitch: < 40μm
- Stitch-bonding
- Loop-length: 70μm up to 20mm
- Variable loop form functions
- Constant wire length
- Constant loop height
- Individual loop shapes
