Key points:

  • QUALITY (IPC class/form 2/3, high first yield, first time right)
  • COMPLEXITY (uBGA, 01005, chip, sensor, blind and buried via’s, PCB till 50x60cm, HF)
  • RELIABILITY (achieving appointments and consistent quality)
  • SHORT DELIVERY TIMES (energetic acquisition en flexible production)
  • FLEXIBILITY (project organization, short lines of communication)
  • KNOW-HOW (motivated team, high problem solving capacity)

Your partner in:

  • Rapid prototyping
  • 0-series
  • Small and medium series (up-to 10k)
  • High volume (10k+ possibly also through partners in Asia)
  • Modification and repair (incl. BGA-repair)
  • Specials (Chip on Board, HF, sensors, etc.)


  • Design (hardware/embedded software)
  • Advise in the design phase (technology, PCB-layout, components options, costs, specific requirements for application, supply chain, etc. – DFX / DFM / DFT)
  • Acquisition (administration of PCB’s and components)
  • SMD assembly (incl. 01005, uBGA, etc.)
  • Die & Wire bonding (bare chip on board)
  • Cleanroom assembly
  • Pressfit
  • Cable assembly
  • Testing modules and systems (incl. flying probe)
  • Cleaning, Potting and caoting of PCBA’s
  • Assembly of modules an systems
  • Modification
  • Service&Repair (incl. BGA-repair)
  • Programming of modules and IC’s